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Toshiba KBG30ZMS512G internal solid state drive 512 GB M.2 PCI Express 3.1 NVMe TLC
SKU
KBG30ZMS512G
- Toshiba 64-Layer BiCS FLASHTM
- PCIe® Gen3 2L NVMeTM
- Capacities up to 512GB
- M.2 1620 single package and M.2 2230 single-sided form factor
- TCG OPAL 2.01 Optional for SED
Category: Internal Solid State Drives
| SSD form factor | M.2 |
|---|---|
| Hardware encryption | No |
| Memory type | TLC |
| SSD capacity | 512 GB |
| SKU | KBG30ZMS512G |
| EAN | 4047999606031 |
| Manufacturer | Toshiba |
| Availability | Out of Stock |
| Product Manuals (HTML) |
View Manual |
The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.
BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.
The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.
BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.
The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.
| Hard drive | |
|---|---|
| SSD capacity | 512 GB |
| Memory type | TLC |
| Data transmission | |
| Read speed | 1500 MB/s |
| Write speed | 1000 MB/s |
| Features | |
| Interface | PCI Express 3.1 |
| Component for | Laptop |
| NVMe | Yes |
| SSD capacity | 512 GB |
| Read speed | 1500 MB/s |
| Write speed | 1000 MB/s |
| Memory type | TLC |
| Hardware encryption | No |
| SSD form factor | M.2 |
| Harmonized System (HS) code | 84717070 |
| Power | |
| Power consumption (write) | 3.3 W |
| Power consumption (read) | 3.3 W |
| Operating voltage | 3.3 V |
| Performance | |
| Interface | PCI Express 3.1 |
| Component for | Laptop |
| NVMe | Yes |
| SSD capacity | 512 GB |
| Read speed | 1500 MB/s |
| Write speed | 1000 MB/s |
| Memory type | TLC |
| Hardware encryption | No |
| Design | |
|---|---|
| Component for | Laptop |
| SSD form factor | M.2 |
| Weight & dimensions | |
| Width | 22 mm |
| Weight | 2.42 g |
| Height | 2.38 mm |
| Depth | 30 mm |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 80 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating shock | 14.7 G |
| Non-operating shock | 1.5 G |
| Operating vibration | 196 G |
| Non-operating vibration | 20 G |
| Technical details | |
| Interface | PCI Express 3.1 |
| Operating temperature (T-T) | 0 - 80 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Operating shock | 14.7 G |
| Non-operating shock | 1.5 G |
| Operating vibration | 196 G |
| Non-operating vibration | 20 G |
| Hardware encryption | No |
| SSD form factor | M.2 |
| Logistics data | |
| Harmonized System (HS) code | 84717070 |